Image sensor chip, method of operating the same, and system including the same

ABSTRACT

A method of operating an image sensor chip, which includes a color sensor pixel and a dynamic vision sensor (DVS) pixel sensing a motion of an object, is provided. The method includes enabling one of the color sensor pixel and the DVS pixel according to a mode selection signal and processing a pixel signal output from the enabled pixel.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority under 35 U.S.C. §119(a) from KoreanPatent Application No. 10-2012-0072462 filed on Jul. 3, 2012, thedisclosure of which is hereby incorporated by reference in its entirety.

BACKGROUND

Exemplary Embodiments relate to an image sensor chip. More particularly,exemplary embodiments relate to a method of obtaining image data basedon a pixel signal output from one of a color sensor pixel and a motionsensor pixel in an image sensor chip and systems using the method.

A complementary metal-oxide semiconductor (CMOS) image sensor is asensing device using CMOS. The CMOS image sensor is cheaper than acharge coupled device (CCD) image sensor, and consumes less power thanthe CCD image sensor. The CMOS image sensor consumes less power than theCCD image sensor because the CMOS image sensor includes smaller elementsthan the CCD image sensor. In addition, as performance of the CMOS imagesensor has improved, the CMOS image sensor is used for electricalappliances, including portable devices, i.e., smart phones and digitalcameras.

However, a CMOS image sensor in a mobile environment requires minimumpower consumption. Since there is a trade-off relationship between powerconsumption and performance, it is desired to minimize the powerconsumption while still maintaining the performance of the CMOS imagesensor.

SUMMARY

According to an aspect of an exemplary embodiment, there is provided amethod of operating an image sensor chip which includes a color sensorpixel and a dynamic vision sensor (DVS) pixel sensing a motion of anobject. The method includes enabling one of the color sensor pixel andthe DVS pixel according to a mode selection signal and processing apixel signal output from the enabled pixel.

The method may further include, before the enabling one of the colorsensor pixel and the DVS pixel, enabling the DVS pixel by default andchanging a level of the mode selection signal based on a pixel signaloutput from the default enabled DVS pixel.

According to an aspect of another exemplary embodiment, there isprovided a method of operating an image sensor chip which includes acolor sensor pixel and a DVS pixel sensing a motion of an object. Themethod includes enabling the DVS pixel, determining whether to enablethe color sensor pixel according to a mode selection signal, andprocessing a pixel signal output from one of the DVS pixel and the colorsensor pixel, based on a determination result and the mode selectionsignal.

According to an aspect of another exemplary embodiment, there isprovided an image sensor chip including a pixel array including a colorsensor pixel group, the color sensor pixel group includes a plurality ofcolor sensor pixels, and a DVS pixel group, the DVS pixel group includesa plurality of DVS pixels sensing a motion of an object; a controlcircuit which is configured to enable one of the color sensor pixelgroup and the DVS pixel group according to a mode selection signal; anda pixel signal processing circuit which is configured to process pixelsignals output from the enabled pixel group.

The image sensor chip may further include a motion sensor pixel enablecontroller, which is configured to control a power supply to the DVSpixel group according to a control of the control circuit.

The pixel signal processing circuit may include a row address eventrepresentation (AER) which is configured to process at least one of aplurality of event signals generated by the respective DVS pixels and acolumn AER which is configured to process at least another one of theevent signals generated by the respective DVS pixels. The row AER may bedisposed opposite a row driver which enables each of the color sensorpixels.

Alternatively, the pixel signal processing circuit may include a row AERwhich is configured to process at least one of a plurality of eventsignals generated by the respective DVS pixels and a column AER which isconfigured to process at least another one of the event signalsgenerated by the respective DVS pixels. The row AER may be disposed at asame side as a side of a row driver which enables each of the colorsensor pixels.

According to an aspect of another exemplary embodiment, there isprovided a system-on-chip (SoC) including the above-described imagesensor chip, an image signal processor (ISP) which is configured toprocess image data output from the image sensor, and a centralprocessing unit (CPU) which is configured to receive processed imagedata from the ISP and to generate a mode selection signal based on theprocessed image data.

According to an aspect of another exemplary embodiment, there isprovided an image sensor chip including a pixel array including a colorsensor pixel, a depth sensor pixel, and a DVS pixel; and an outputselection circuit which is configured to select one of a signal receivedfrom the color sensor pixel and the depth sensor pixel and a signalreceived from the DVS pixel according to a mode selection signal and tooutput the selected signal.

According to an aspect of another exemplary embodiment, there isprovided an image processing system including an image sensor whichgenerates digital image data corresponding to either color image datafrom at least one color sensor pixel or motion image data from at leastone motion sensor pixel, and transmits the digital image data; an imagesignal processor (ISP) which is configured to receive and process thedigital image data from the image sensor, and transmit the processedimage data; and a display unit which receives the processed image datafrom the ISP, and displays the processed image data.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and advantages of the exemplary embodimentswill become more apparent by describing in detail exemplary embodimentsthereof with reference to the attached drawings, in which:

FIG. 1 is a block diagram of an image processing system according tosome embodiments;

FIG. 2 is a block diagram of an image sensor illustrated in FIG. 1according to some embodiments;

FIG. 3 is a block diagram of an image sensor including an example of apixel signal processing circuit illustrated in FIG. 2;

FIG. 4 is a diagram of a pixel arrangement of a pixel array illustratedin FIG. 2 according to some embodiments;

FIG. 5 is a diagram of a pixel arrangement of the pixel arrayillustrated in FIG. 2 according to other embodiments;

FIG. 6 is a diagram of a pixel arrangement of the pixel arrayillustrated in FIG. 2 according to further embodiments;

FIG. 7 is a diagram of a pixel arrangement of the pixel arrayillustrated in FIG. 2 according to other embodiments;

FIG. 8A is a diagram of a pixel arrangement of the pixel arrayillustrated in FIG. 2 according to yet other embodiments;

FIG. 8B is a diagram of a pixel arrangement of the pixel arrayillustrated in FIG. 2 according to still other embodiments;

FIG. 9A is a diagram of a pixel arrangement of the pixel arrayillustrated in FIG. 2 according to further embodiments;

FIG. 9B is a diagram of a pixel arrangement of the pixel arrayillustrated in FIG. 2 according to other embodiments

FIG. 10 is a diagram of wiring of the pixel array illustrated in FIG. 4according to some embodiments;

FIG. 11 is a diagram of wiring of the pixel array illustrated in FIG. 4according to other embodiments;

FIG. 12A is a circuit diagram of a color sensor pixel illustrated inFIG. 10 according to some embodiments;

FIG. 12B is a circuit diagram of the color sensor pixel illustrated inFIG. 10 according to other embodiments;

FIG. 12C is a circuit diagram of the color sensor pixel illustrated inFIG. 10 according to further embodiments;

FIG. 12D is a circuit diagram of the color sensor pixel illustrated inFIG. 10 according to other embodiments;

FIG. 12E is a circuit diagram of the color sensor pixel illustrated inFIG. 10 according to other embodiments;

FIG. 13 is a diagram of a motion sensor pixel illustrated in FIG. 10according to some embodiments;

FIG. 14 is a block diagram of the image sensor illustrated in FIG. 1according to other embodiments;

FIG. 15 is a block diagram of the image sensor illustrated in FIG. 1according to further embodiments;

FIG. 16 is a block diagram of the image sensor illustrated in FIG. 1according to other embodiments;

FIG. 17 is a block diagram of an image sensor including another exampleof the pixel signal processing circuit illustrated in FIG. 2;

FIG. 18 is a block diagram of an image sensor including another exampleof the pixel signal processing circuit illustrated in FIG. 2;

FIG. 19 is a block diagram of a modification of the pixel signalprocessing circuit illustrated in FIG. 18;

FIG. 20 is a block diagram of an image sensor including another exampleof the pixel signal processing circuit illustrated in FIG. 2;

FIG. 21 is a block diagram of an image sensor including an example of apixel signal processing circuit illustrated in FIG. 15;

FIG. 22 is a block diagram of an image sensor including another exampleof the pixel signal processing circuit illustrated in FIG. 15;

FIG. 23 is a block diagram of an image sensor including another exampleof the pixel signal processing circuit illustrated in FIG. 15;

FIG. 24 is a block diagram of an image sensor including another exampleof the pixel signal processing circuit illustrated in FIG. 15;

FIG. 25 is a flowchart of a method of operating an image sensor chipaccording to some embodiments;

FIG. 26 is a flowchart of a method of operating an image sensor chipaccording to other embodiments;

FIG. 27 is a flowchart of a method of operating an image sensor chipaccording to further embodiments;

FIG. 28 is a block diagram of an electronic system including an imagesensor illustrated in FIG. 1 according to some embodiments; and

FIG. 29 is a block diagram of a system including the image sensorillustrated in FIG. 1 according to some embodiments.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

Exemplary embodiments will be described more fully hereinafter withreference to the accompanying drawings, in which embodiments are shown.This exemplary embodiments may, however, be embodied in many differentforms and should not be construed as limited to the embodiments setforth herein. Rather, these embodiments are provided so that thisdisclosure will be thorough and complete, and will fully convey thescope of the exemplary embodiments to those skilled in the art. In thedrawings, the size and relative sizes of layers and regions may beexaggerated for clarity. Like numbers refer to like elements throughout.

It will be understood that when an element is referred to as being“connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent. In contrast, when an element is referred to as being “directlyconnected” or “directly coupled” to another element, there are nointervening elements present. As used herein, the term “and/or” includesany and all combinations of one or more of the associated listed itemsand may be abbreviated as “/”.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, these elements should notbe limited by these terms. These terms are only used to distinguish oneelement from another. For example, a first signal could be termed asecond signal, and, similarly, a second signal could be termed a firstsignal without departing from the teachings of the disclosure.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the exemplaryembodiments. As used herein, the singular forms “a”, “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises” and/or “comprising,” or “includes” and/or “including” whenused in this specification, specify the presence of stated features,regions, integers, steps, operations, elements, and/or components, butdo not preclude the presence or addition of one or more other features,regions, integers, steps, operations, elements, components, and/orgroups thereof.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which these exemplary embodimentsbelong. It will be further understood that terms, such as those definedin commonly used dictionaries, should be interpreted as having a meaningthat is consistent with their meaning in the context of the relevant artand/or the present application, and will not be interpreted in anidealized or overly formal sense unless expressly so defined herein.

FIG. 1 is a block diagram of an image processing system 10 according tosome embodiments. The image processing system 10 may include an imagesensor 100, an image signal processor (ISP) 200, a display unit 205, acentral processing unit (CPU) 210, and a peripheral circuit 220. Theimage processing system 10 may be implemented as a system-on-chip (SoC).

The image processing system 10 may have both a function of a colorsensor obtaining color image data of an object, and a function of amotion sensor sensing the motion of the object, and obtaining motionimage data. The motion sensor may analyze an image continuously shot byframes and may store shading information of the analyzed frame in aframe memory (not shown) in a form of a digital code. The motion sensormay compare shading information of a previous frame, that has beenstored in the frame memory, with shading information of a current frame,that is presently input, and sense the motion of an object. In addition,when obtaining shading information of a pixel, the motion sensor mayprocess shading information of adjacent pixels (e.g., four pixels inrespective four directions) at the same time, and calculate the movingdirection of shading.

Alternatively, the motion sensor may include a signal storage element(e.g., a capacitor) in a pixel. The motion sensor may store a voltagecorresponding to a pixel signal of a previous frame, compare the voltagewith a voltage corresponding to a pixel signal of a current frame, andsense the motion of an object.

The image sensor 100 may generate color image data output from at leastone color sensor pixel (not shown) or motion image data output from atleast one motion sensor pixel (not shown), and transmit digital imagedata IDATA to the ISP 200. The image sensor 100 may output the imagedata IDATA corresponding to the color image data or the motion imagedata, according to a mode selection signal MSEL received from the CPU210.

For instance, the image sensor 100 may output the image data IDATA,corresponding to the motion image data, when the mode selection signalMSEL is at a low level and may output the image data IDATA,corresponding to the color image data, when the mode selection signalMSEL is at a high level. However, the exemplary embodiments are notlimited to these examples. In other embodiments, the image sensor 100may include at least one depth sensor pixel (not shown), and outputdepth image data together with the color image data.

The image sensor 100 may be implemented as a separate chip. The imagesensor 100 may be a complementary metal-oxide semiconductor (CMOS) imagesensor.

The ISP 200 may receive the image data IDATA, process the image dataIDATA, and generate a processed image data IDATA′. The ISP 200 mayprocess the image data IDATA into frames. The ISP 200 may also adjustthe brightness, contrast, and color saturation of the image data IDATA.When the image data IDATA includes depth image data, the ISP 200 maygenerate depth information of the depth sensor pixel using atime-of-flight (TOF) method, and embed the depth information in theprocessed image data IDATA′.

The ISP 200 may include the frame memory, compare the shadinginformation of a previous frame with the shading information of acurrent frame, and generate motion image data according to a comparisonresult. Alternatively, the ISP 200 may process the shading informationof a pixel and the shading information of adjacent pixels together, andcalculate the moving direction of shading. The ISP 200 may also transmitthe processed image data IDATA′ to the display unit 205 and the CPU 210.

The ISP 200 may control a control register block (not shown) included inthe image sensor 100, such that the overall operation of the imagesensor 100 is controlled. Although the ISP 200 is implemented outsidethe image sensor 100 in the embodiments illustrated in FIG. 1, exemplaryembodiment are not restricted. The ISP 200 may be implemented inside theimage sensor 100.

The display unit 205 may display the processed image data IDATA′. Thedisplay unit 205 may be any device that can output images. The displayunit 205 may be implemented as an electronic device, such as a computer,a mobile phone, or a camera.

The CPU 210 may receive the processed image data IDATA′ from the ISP200, and generate the mode selection signal MSEL based on the processedimage data IDATA′. The CPU 210 may transmit the mode selection signalMSEL to the image sensor 100.

When the image processing system 10 is powered on, the CPU 210 mayoutput the mode selection signal MSEL at a default level, e.g., the lowlevel. When the CPU 210 determines that mode modification is necessary,based on the processed image data IDATA′, it may output the modeselection signal MSEL at a changed level, e.g., the high level.

The CPU 210 may compare the processed image data IDATA′ with a modemodification code that has been stored to generate the mode selectionsignal MSEL. When the processed image data IDATA′ is the same as themode modification code, the CPU 210 may change the level of the modeselection signal MSEL.

The mode modification code may be a specific two-dimensional (2D) image,such as a person's fingerprint or face, a three-dimensional (3D) imageincluding depth information, or a reference motion image correspondingto a continuous motion, such as a hand gesture.

When the mode modification code is a motion image of a finger drawing acircle, the CPU 210 may determine whether the processed image dataIDATA′ corresponds to the motion image of a finger drawing a circle, andgenerate the mode selection signal MSEL according to a determinationresult. However, the exemplary embodiments are not be limited by thetype of the mode modification code.

In a case where only the motion sensor operates by default and the colorsensor pixel is deactivated in a sleep mode, when a specific motioninput by a user is the same as the mode modification code, the CPU 210may activate the color sensor pixel or a system connected to the imageprocessing system, such as a power system, an audio system, or aspecific application.

The mode modification code may be changed at a user's request and may beset to a default value.

The CPU 210 may generate the mode selection signal MSEL based on asignal (or data) received from the peripheral circuit 220, and transmitthe mode selection signal MSEL to the image sensor 100.

The image sensor 100 may output the image data IDATA corresponding tocolor image data, or motion image data according to the mode selectionsignal MSEL. The peripheral circuit 220 may provide a signal (or data)generated according to a system state or input for the CPU 210.

The peripheral circuit 220 may be implemented as an input/output (I/O)interface. In this case, the peripheral circuit 220 may transmit asignal generated according to a user's input to the CPU 210. The I/Ointerface may be any type of I/O device, such as an external inputbutton, a touch screen, or a mouse.

Alternatively, the peripheral circuit 220 may be implemented as a powermonitoring module. In this case, when the peripheral circuit 220determines that system power is not sufficient, it may transmit a signalcorresponding to the determination to the CPU 210. As anotheralternative, the peripheral circuit 220 may be implemented as anapplication execution module. In this case, when a specific applicationis executed, the peripheral circuit 220 may transmit a signal generatedby the execution to the CPU 210. The specific application may be acamera shooting application, an augmented reality application, or anapplication requiring a camera image.

FIG. 2 is a block diagram of an image sensor 100A according to someembodiments. The image sensor 100A may include a pixel array 110, acontrol logic (or a control circuit) 120, a row driver 130, a motionsensor pixel enable controller 140, and a pixel signal processingcircuit 150.

The pixel array 110 includes a plurality of color sensor pixels Cobtaining color image data of an object, and a plurality of motionsensor pixels M sensing the motion of the object. The pixel array 110may also include a color filter array, (not shown) which includes aplurality of color filter layers (not shown) transmitting light with apredetermined wavelength.

The pixel array 110 may also include a depth sensor pixel (not shown)obtaining depth information of the object. When a pixel signal of thedepth sensor pixel is processed using the TOF method, the image sensor100A may also include an infrared pass filter (not shown) which filtersout light other than infrared light emitted by an infrared light source(not shown) controlled by the control logic 120, and infrared lightreflected from an object after being emitted by the infrared lightsource.

The motion sensor pixels M may be implemented by dynamic vision sensor(DVS) pixels, but exemplary embodiments are not restricted.

The control logic 120 may control the overall operation of the imagesensor 100A based on the mode selection signal MSEL. The control logic120 may control the row driver 130, the motion sensor pixel enablecontroller 140, and pixel signal processing circuit 150.

The row driver 130 may enable the color sensor pixels C by rows,according to the control of the control logic 120.

The motion sensor pixel enable controller 140 may enable the motionsensor pixels M, according to the control of the control logic 120. Themotion sensor pixel enable controller 140 may also control power supplyto the motion sensor pixels M, according to the control of the controllogic 120.

The control logic 120 may control the row driver 130 and the motionsensor pixel enable controller 140 based on the mode selection signalMSEL to enable a group, among a color sensor pixel group including thecolor sensor pixels C and a motion sensor pixel group including themotion sensor pixels M. At this time, the pixel signal processingcircuit 150 may process a pixel signal (e.g., a pixel signal output fromeach of the motion sensor pixels M or a pixel signal output from each ofthe color sensor pixels C) output from the pixel array 110, and output aprocessing result as the image data IDATA.

Alternatively, the control logic 120 may control only whether to enablethe color sensor pixel group, including the color sensor pixels C,according to the mode selection signal MSEL in a state where the motionsensor pixel group including the motion sensor pixels M has beenenabled. At this time, the pixel signal processing circuit 150 mayselect a pixel signal output from a motion sensor pixel M, or a pixelsignal output from a color sensor pixel C according to the control ofthe control logic 120, and output the image data IDATA based on aselection result.

When the motion sensor pixels M are implemented by DVS pixels, the pixelsignal processing circuit 150 may include an address eventrepresentation (AER) (not shown). The AER may process an event signaloutput from each of the motion sensor pixels M sensing a change in thequantity of light, and transmit a reset signal to each motion sensorpixel M that has generated the event signal. The disposition of the AERwill be described in detail with reference to FIGS. 3, 17, 18, and 20later.

When the pixel array 110 includes depth sensor pixels (not shown),enabling control on the depth sensor pixels and processing of pixelsignals, output from the depth sensor pixels, are substantially the sameas enabling control on the color sensor pixels C and processing of pixelsignals, output from the color sensor pixels C.

FIG. 3 is a block diagram of an image sensor 100A-1 including an example150A of the pixel signal processing circuit 150 illustrated in FIG. 2.FIG. 3 shows the image sensor 100A-1 that include the motion sensorpixels M implemented by DVS pixels.

Referring to FIGS. 2 and 3, the pixel signal processing circuit 150Aillustrated in FIG. 3 may include a column AER 154, a read-out circuit156, a row AER 158, and an output selection circuit 160.

Each of the motion sensor pixels M included in the pixel array 110 mayoutput an event signal according to a change in the quantity of light.The event signal will be described in detail with reference to FIG. 13.The column AER 154 may receive the event signal and output a columnaddress value of each motion sensor pixel M, which has generated theevent signal, based on the event signal.

The read-out circuit 156 may receive a pixel signal output from each ofthe color sensor pixels C included in the pixel array 110, and processthe pixel signal.

The read-out circuit 156 may include a column decoder (not shown), acolumn driver (not shown), a correlated double sampling (CDS) block (notshown), an analog-to-digital converter (ADC) block (not shown), and anoutput buffer (not shown).

The column AER 154 and the read-out circuit 156 may be implemented inseparate circuits, respectively.

The row AER 158 may receive the event signal output from each motionsensor pixel M, and output a row address value of each motion sensorpixel M, which has generated the event signal, based on the eventsignal. The row address value may be transmitted to the output selectioncircuit 160.

The row AER 158 may be implemented opposite the row driver 130.

The output selection circuit 160 may select at least one output among anoutput of the column AER 154, an output of the row AER 158, and anoutput of the read-out circuit 156, according to the control of thecontrol logic 120, and output the image data IDATA based on a selectionresult.

The output selection circuit 160 may select the output of the column AER154 and the output of the row AER 158 according to the control of thecontrol logic 120, and output the image data IDATA based on a selectionresult.

Alternatively, the output selection circuit 160 may select the output ofthe read-out circuit 156 according to the control of the control logic120, and output the image data IDATA based on a selection result.

The output selection circuit 160 may be implemented by a unit, e.g., amultiplexer, which selects one from among a plurality of input signals.However, the exemplary embodiments are not restricted thereto. When asignal is output from one of the color sensor pixel group, including thecolor sensor pixels C, and the motion sensor pixel group, including themotion sensor pixels M, the output selection circuit 160 may bypass thesignal.

When the pixel array 110 includes the depth sensor pixels, the outputselection circuit 160 may select a pixel signal output from a colorsensor pixel C or a depth sensor pixel or a pixel signal output from amotion sensor pixel M, according to the mode selection signal MSEL, andoutput the selected signal.

FIG. 4 is a diagram of a pixel arrangement 110-1 of the pixel array 110illustrated in FIG. 2 according to some embodiments. FIG. 5 is a diagramof a pixel arrangement 110-2 of the pixel array 110 illustrated in FIG.2, according to other embodiments. FIG. 6 is a diagram of a pixelarrangement 110-3 of the pixel array 110 illustrated in FIG. 2 accordingto further embodiments. FIG. 7 is a diagram of a pixel arrangement 110-4of the pixel array 110 illustrated in FIG. 2 according to otherembodiments. FIG. 8A is a diagram of a pixel arrangement 110-5 a of thepixel array 110 illustrated in FIG. 2 according to yet otherembodiments. FIG. 8B is a diagram of a pixel arrangement 110-5 b of thepixel array 110 illustrated in FIG. 2 according to still otherembodiments. FIG. 9A is a diagram of a pixel arrangement 110-6 a of thepixel array 110 illustrated in FIG. 2 according to further embodiments.FIG. 9B is a diagram of a pixel arrangement 110-6 b of the pixel array110 illustrated in FIG. 2 according to other embodiments.

For convenience, it is assumed that the pixel array 110 has a 5×5 matrixform, with 5 rows and 5 columns, in the embodiments illustrated in FIGS.4 through 7. However, the exemplary embodiments are not restrictedthereto.

Referring to FIG. 2 and FIGS. 4 through 7, the pixel array 110 mayinclude the color sensor pixel group including the color sensor pixelsC, and the motion sensor pixel group including the motion sensor pixelsM. The motion sensor pixel group may include DVS pixels that may operatewith a lower power than the color sensor pixels C.

Either or both of the color sensor pixel group and the motion sensorpixel group may be enabled, according to the mode selection signal MSEL.

When the motion sensor pixel group that operates with low power isenabled by default, the color sensor pixel group is in the sleep mode,and a user's motion is the same as the motion modification code, thecolor sensor pixel group may be enabled according to the mode selectionsignal MSEL. In the pixel arrangement 110-1 illustrated in FIG. 4, eachof the color sensor pixels C may be placed between motion sensor pixelsM.

A plurality of motion sensor pixels M may be placed between adjacentcolor sensor pixels C, but exemplary embodiments are not restrictedthereto.

Alternatively, the color sensor pixels C and the motion sensor pixels Mmay be arranged at irregular intervals.

The pixel arrangement 110-2 illustrated in FIG. 5 may include the colorsensor pixel group, placed in an inner side, and the motion sensorpixels M, placed at the border of the color sensor pixel group.

In other words, the motion sensor pixel group including the motionsensor pixels M may be arranged at the edge of the color sensor pixelgroup including the color sensor pixels C. Alternatively, the colorsensor pixels C may be arranged at the edge of the motion sensor pixelgroup including the motion sensor pixels M.

Although the motion sensor pixels M are arranged in a single line at theborder of the color sensor pixel group, they may be arranged in multiplelines.

The pixel arrangement 110-3 illustrated in FIG. 6 may include only colorsensor pixels C or only motion sensor pixels M, in each column. In otherwords, the motion sensor pixels M alternate with the color sensor pixelsC in a row direction (i.e., in a horizontal direction).

Although a column of color sensor pixels C alternates with a column ofmotion sensor pixels M in the embodiments illustrated in FIG. 6, aplurality of columns of motion sensor pixels M may be placed betweenadjacent columns of color sensor pixels C.

Columns of color sensor pixels C and columns of motion sensor pixels Mmay be arranged at irregular intervals.

The columns of color sensor pixels C and the columns of motion sensorpixels M may include line-optical black (L-OB) pixels to remove rownoise. For instance, a column of L-OB pixels may be arranged at each ofthe left and right sides of an area in which the columns of color sensorpixels C and the columns of motion sensor pixels M are arranged.However, exemplary embodiments are not restricted to this example.

The row noise is noise that is included in a pixel signal, output from acolor sensor pixel C. The row noise may cause a horizontally strippedpattern to occur in the image data IDATA. The row noise is mainly causedby the change in power supplied to the image sensor 100, noise occurringat the driving of the row driver 130, etc. The row noise has atime-variant characteristic.

The ISP 200 may remove the row noise by subtracting a pixel signal of anL-OB pixel from a pixel signal of a color sensor pixel C in the same rowas the L-OB pixel, and generate the processed image data IDATA′.

The L-OB pixel may include a shield layer (not shown) shielding incidentlight.

The pixel arrangement 110-4 illustrated in FIG. 7 may include only colorsensor pixels C, or only motion sensor pixels M in each row. In otherwords, the motion sensor pixels M alternate with the color sensor pixelsC in a column direction (i.e., in a vertical direction).

Although a row of color sensor pixels C alternates with a row of motionsensor pixels M in the embodiments illustrated in FIG. 7, a plurality ofrows of motion sensor pixels M may be placed between adjacent rows ofcolor sensor pixels C.

Rows of color sensor pixels C and rows of motion sensor pixels M may bearranged at irregular intervals.

The rows of color sensor pixels C and the rows of motion sensor pixels Mmay include L-OB pixels to remove row noise.

FIGS. 8A through 9B illustrate different pixel arrangements 110-5 a and110-6 a of the pixel array 110, depending on the relative sizes of themotion sensor pixels M and the color sensor pixels C, and differentpixel arrangements 110-5 b and 110-6 b of the pixel array 110 when thepixel array 110 includes a depth sensor pixel Z.

The pixel arrangement 110-5 a illustrated in FIG. 8A corresponds to acase where the size of motion sensor pixels M is the same as that of RGBcolor sensor pixels R, G, and B. Since a single motion sensor pixel Mhas the same size as each of the RGB color sensor pixels R, G, and B,when the pixel array 110 has a 2×2 matrix form, the pixel arrangement110-5 a includes one motion sensor pixel M and the RGB color sensorpixels R, G, and B.

In the pixel arrangement 110-5 b illustrated in FIG. 8B, the RGB colorsensor pixels R, G, and B and a depth sensor pixel Z are arranged in aBayer pattern. RGB color sensor pixels R, G, and B and depth sensorpixels Z may form a 3D sensor pixel group. At least one motion sensorpixel M may be placed around the Bayer pattern.

The pixel arrangement 110-6 a illustrated in FIG. 9A corresponds to acase where the size of a motion sensor pixel M is the same as the sizeof a group of four RGB color sensor pixels R, G, and B. Since the sizeof the single motion sensor pixel M is the same as that of a Bayerpattern composed of four RGB color sensor pixels R, G, and B, the motionsensor pixel M and the four RGB color sensor pixels R, G, and B may bearranged according to one of the pixel arrangements 110-1 through 110-4,which are respectively illustrated in FIGS. 4 through 7.

In the pixel arrangement 110-6 b illustrated in FIG. 9B, the size of amotion sensor pixel M is the same as that of a Bayer pattern included ina 3D sensor pixel group. At this time, the Bayer pattern and the motionsensor pixel M may be arranged according to one of the pixelarrangements 110-1 through 110-4, which are respectively illustrated inFIGS. 4 through 7.

The relative sizes of the motion sensor pixels M and the color sensorpixels C may be modified variously.

FIG. 10 is a diagram of wiring of the pixel array 110-1 illustrated inFIG. 4 according to some embodiments. Referring to FIGS. 4 and 10, FIG.10 shows a part 112 of the pixel array 110 illustrated in FIG. 4, andthe column AER 154 and the read-output circuit 156, which areimplemented as separate circuits, respectively. The part 112 of thepixel array 110 includes a color sensor pixel C, a first motion sensorpixel 112-1, and a second motion sensor pixel 112-2.

The first motion sensor pixel 112-1 has the same row address as thecolor sensor pixel C. The second motion sensor pixel 112-2 has the samecolumn address as the color sensor pixel C. Wiring extending in the rowdirection may include a selection signal line SEL, a reset signal lineRS, a transfer signal line TG, a row AER event signal line REQY, and arow AER reset signal line ACKY.

The selection signal line SEL may be connected to the row driver 130 andthe color sensor pixel C. The row driver 130 may transmit a selectionsignal to the color sensor pixel C through the selection signal lineSEL.

The reset signal line RS and the transfer signal line TG may also beconnected to the row driver 130 and the color sensor pixel C. The rowdriver 130 may transmit a reset signal and a transmission signal to thecolor sensor pixel C through the reset signal line RS and the transfersignal line TG, respectively.

The row AER event signal line REQY may be connected to the row AER 158and the first motion sensor pixel 112-1. The first motion sensor pixel112-1 may transmit an on/off event signal to the row AER 158 through therow AER event signal line REQY.

The row AER reset signal line ACKY may also be connected to the row AER158 and the first motion sensor pixel 112-1. The row AER 158 maytransmit a first DVS reset signal to the first motion sensor pixel 112-1through the row AER reset signal line ACKY.

Wiring extending in the column direction may include a pixel signal linePIXEL, a column AER on-event signal line REQX_ON, a column AER off-eventsignal line REQX_OFF, and a column AER reset signal line ACKX.

The pixel signal line PIXEL may be connected to the read-out circuit 156and the color sensor pixel C. The color sensor pixel C may transmit apixel signal to the read-out circuit 156 through the pixel signal linePIXEL.

The column AER on-event signal line REQX_ON may be connected to thecolumn AER 154 and the second motion sensor pixel 112-2. The secondmotion sensor pixel 112-2 may transmit an on-event signal to the columnAER 154 through the column AER on-event signal line REQX_ON.

The column AER off-event signal line REQX_OFF may be connected to thecolumn AER 154 and the second motion sensor pixel 112-2. The secondmotion sensor pixel 112-2 may transmit an off-event signal to the columnAER 154 through the column AER off-event signal line REQX_OFF.

The column AER reset signal line ACKX may be connected to the column AER154 and the second motion sensor pixel 112-2. The column AER 154 maytransmit a second DVS reset signal to the second motion sensor pixel112-2 through the column AER reset signal line ACKX.

When the pixel array 110 includes depth sensor pixels Z in otherembodiments, a wiring structure for the depth sensor pixels Z issubstantially the same as that for the color sensor pixel C illustratedin FIG. 10.

The signals transmitted through the signals lines illustrated in FIG. 10will be described in detail with reference to FIGS. 12A through 13.

FIG. 11 is a diagram of wiring of the pixel array 110-1 illustrated inFIG. 4 according to other embodiments. Referring to FIGS. 4 and 11, asfor the wiring in the column direction, the pixel signal line PIXEL andthe column AER reset signal line ACKX, which are shown in FIG. 10, maybe implemented into a common signal line ACKX&PIXEL. In other words, thecommon signal line ACKX&PIXEL may be connected to the color sensor pixelC, the motion sensor pixel M, and a signal path selection circuit 170.

The signal path selection circuit 170 may connect the common signal lineACKX&PIXEL to the read-out circuit 156 or the column AER 154, accordingto the control of the control logic 120. The signal path selectioncircuit 170 may be implemented by a demultiplexer.

When the mode selection signal MSEL is at a first level, e.g., a lowlevel, the control logic 120 may control the signal path selectioncircuit 170 to connect the common signal line ACKX&PIXEL to the columnAER 154. Therefore, the common signal line ACKX&PIXEL may function asthe column AER reset signal line ACKX.

When the mode selection signal MSEL is at a second level, e.g., a highlevel, the control logic 120 may control the signal path selectioncircuit 170 to connect the common signal line ACKX&PIXEL to the read-outcircuit 156. Therefore, the common signal line ACKX&PIXEL may functionas the pixel signal line PIXEL.

For convenience, the color sensor pixel C, the first motion sensor pixel112-1, and the second motion sensor pixel 112-2 are only described inthe embodiments illustrated in FIGS. 10 and 11, but the wiringillustrated in FIG. 10 or 11 may be applied to every motion sensor pixelM and every color sensor pixel C included in the pixel array 110.

FIG. 12A is a circuit diagram of the color sensor pixel C illustrated inFIG. 10 according to some embodiments. FIG. 12B is a circuit diagram ofthe color sensor pixel C illustrated in FIG. 10 according to otherembodiments. FIG. 12C is a circuit diagram of the color sensor pixel Cillustrated in FIG. 10 according to further embodiments. FIG. 12D is acircuit diagram of the color sensor pixel C illustrated in FIG. 10according to other embodiments. FIG. 12E is a circuit diagram of thecolor sensor pixel C illustrated in FIG. 10 according to otherembodiments.

Referring to FIG. 12A, a unit color sensor pixel 115 a may include aphotodiode PD, a transfer transistor Tx, a floating diffusion node FD, areset transistor Rx, a drive transistor Dx, and a select transistor Sx.

The photodiode PD is an example of a photoelectric conversion element.The photodiode PD may be a photo transistor, a photo gate, a pinnedphotodiode (PPD), or a combination.

FIG. 12A shows a 4-transistor (4T) structure that includes a singlephotodiode PD and four MOS transistors Tx, Rx, Dx, and Sx. However, theexemplary embodiments are not restricted to this example. Any circuitsincluding at least three transistors, including the drive transistor Dxand the select transistor Sx and the photodiode PD, may be used in theembodiments.

In the operation of the unit color sensor pixel 115 a, the photodiode PDgenerates photocharge varying with the intensity of incident light. Thetransfer transistor Tx may transfer the photocharge to the floatingdiffusion node FD, in response to a transfer signal received from therow driver 130 through the transfer signal line TG. The drive transistorDx may amplify and transmit photocharge to the select transistor Sxbased on a potential corresponding to the photocharge accumulated at thefloating diffusion node FD. The select transistor Sx has a drainconnected to a source of the drive transistor Dx, and may output aselection signal received from the row driver 130 through the selectionsignal line SEL to the pixel signal line PIXEL connected to the unitcolor sensor pixel 115 a. The reset transistor Rx may reset the floatingdiffusion node FD to VDD in response to a reset signal received from therow driver 130 through the reset signal line RS.

The unit color sensor pixel 115 a may receive incident light through acolor filter layer (not shown). The color filter layer may include atleast one red filter, at least one green filter, and at least one bluefilter, or it may include at least one magenta filter, at least one cyanfilter, and at least one yellow filter. The unit color sensor pixel 115a may be classified as a red pixel R, a green pixel G, or a blue pixel Baccording to the type of the color filter layer. According to the colorfilter layer, the unit color sensor pixel 115 a may sense incident lighthaving a different wavelength, and the ISP 200 may process a pixelsignal output from each unit color sensor pixel 115 a so as to generatea 2D image.

Other examples of a unit color sensor pixel are illustrated in FIGS. 12Bthrough 12E.

Referring to FIG. 12B, a unit color sensor pixel 115 b has a3-transistor (3T) structure that may include the photodiode PD, thereset transistor Rx, the drive transistor Dx, and the select transistorSx. Photocharge generated by the photodiode PD may be immediatelyaccumulated at the floating diffusion node FD, and the unit color sensorpixel 115 b may output a pixel signal to the pixel signal line PIXELaccording to the operations of the drive transistor Dx and the selecttransistor Sx.

Referring to FIG. 12C, a unit color sensor pixel 115 c has a 3Tstructure that may include the photodiode PD, the transfer transistorTx, the reset transistor Rx, and the drive transistor Dx. The resettransistor Rx may be implemented by an n-channel depression typetransistor. The reset transistor Rx may reset the floating diffusionnode FD to VDD or a low level (e.g., 0 V) in response to the resetsignal received from the row driver 130 through the reset signal lineRS, thereby performing a similar function to the select transistor Sx.In other embodiments, the reset signal may be received through theselection signal line SEL.

Referring to FIG. 12D, a unit color sensor pixel 115 d has a5-transistor (5T) structure that includes the photodiode PD, thetransfer transistor Tx, the reset transistor Rx, the drive transistorDx, the select transistor Sx, and one more transistor Gx.

Referring to FIG. 12E, a unit color sensor pixel 115 e has a 5Tstructure that includes the photodiode PD, the transfer transistor Tx,the reset transistor Rx, the drive transistor Dx, the select transistorSx, and one more transistor Px.

When the pixel array 110 includes depth sensor pixels Z in otherembodiments, the internal structure of the depth sensor pixels Z issubstantially the same as the structure illustrated in one of FIGS. 12Athrough 12E. The depth sensor pixels Z may be implemented in a 2-tapstructure, apart from a 1-tap structure, having the same internalstructure of the color sensor pixel C illustrated in any one of FIGS.12A through 12E.

FIG. 13 is a diagram of the motion sensor pixels M illustrated in FIG.10 according to some embodiments. Referring to FIGS. 10 and 13, themotion sensor pixels M may be DVS pixels. The operation of each of themotion sensor pixels M, which are DVS pixels, will be described indetail with reference to FIG. 13.

A unit DVS pixel 117 may include a photodiode 117-1, acurrent-to-voltage (I/V) converter 117-2, an amplifier circuit 117-3, acomparator circuit 117-4, and a digital logic 117-5.

The photodiode 117-1 is an example of a photoelectric conversionelement. The photodiode 117-1 may be a photo transistor, a photo gate, aPPD, or a combination thereof. The photodiode 117-1 may generate anoptical current I according to the intensity of incident light.

The I/V converter 117-2 may include a converting transistor Cx and aninverter INV. The converting transistor Cx may be provided with power bythe motion sensor pixel enable controller 140.

When a motion sensor pixel group is disabled, the motion sensor pixelenable controller 140 may apply a voltage lower than a predeterminedlevel to the converting transistor Cx so that the converting transistorCx does not operate. The inverter INV may invert a voltage at a terminalof the photodiode 117-1 so as to output a first voltage Vin. In otherwords, the I/V converter 117-2 may sense the optical current I flowingin the photodiode 117-1 and output the first voltage Vin correspondingto the optical current I.

The amplifier circuit 117-3 may include a first capacitor C1, a secondcapacitor C2, an amplifier AMP, and a reset switch SW. The amplifiercircuit 117-3 may output a second voltage Vout, related with a variancein the first voltage Vin over time, based on the first voltage Vin. Thereset switch SW may reset the second voltage Vout to a reset voltageaccording to the control of the digital logic 117-5.

The comparator circuit 117-4 may include a first comparator COMP1 and asecond comparator COMP2. The first comparator COMP1 may compare thesecond voltage Vout with an on-threshold voltage and generate anon-event signal according to a comparison result. The second comparatorCOMP2 may compare the second voltage Vout with an off-threshold voltageand generate an off-event signal according to a comparison result. Inother words, the comparator circuit 117-4 may generate an on-eventsignal or off-event signal when the change in shading of the unit DVSpixel 117 is higher than a predetermined level.

For instance, the on-event signal may be at a high level when theshading of the unit DVS pixel 117 is brighter than a predeterminedlevel, and the off-event signal may be at a high level when the shadingof the unit DVS pixel 117 is darker than a predetermined level. The on-and off-even signals may be transmitted to the digital logic 117-5.

The digital logic 117-5 may generate an event signal according to theon- and off-event signals output from the comparator circuit 117-4. Forinstance, the digital logic 117-5 may include an OR gate to receive theon-event signal and the off-event signal and to generate an on/off eventsignal when one of the on- and off-event signals is at the high level.The on/off event signal may be transmitted to the row AER 158 throughthe row AER event signal line REQY. The OR gate may be implementedoutside the unit DVS pixel 117, for example, inside the row AER 158 inother embodiments.

The digital logic 117-5 may transmit the on-event signal to the columnAER 154 through the column AER on-event signal line REQX_ON, and maytransmit the off-event signal to the column AER 154 through the columnAER off-event signal line REQX_OFF.

The digital logic 117-5 may generate a reset switch signal RS_SWaccording to the on-event and the off-event signals output from thecomparator circuit 117-4. For instance, the digital logic 117-5 mayinclude an OR gate so as to receive the on-event signal and theoff-event signal, and generate the reset switch signal RS_SW when one ofthe on-event and the off-event signals is at the high level. The resetswitch SW may reset the second voltage Vout according to the resetswitch signal RS_SW. The OR gate may be implemented outside the unit DVSpixel 117 in other embodiments.

The OR gate that generates the on/off event signal may be the same asthe OR gate that generates the reset switch signal RS_SW.

The digital logic 117-5 may receive a first DVS reset signal and asecond DVS reset signal through the row AER reset signal line ACKY andthe column AER reset signal line ACKX, respectively. The digital logic117-5 may generate the reset switch signal RS_SW according to the firstDVS reset signal transmitted from the row AER 158, and the second DVSreset signal transmitted from the column AER 154.

For instance, the digital logic 117-5 may include an AND gate togenerate the reset switch signal RS_SW when both the first and secondDVS reset signals are at a high level. The AND gate may be implementedoutside the unit DVS pixel 117.

The unit DVS pixel 117 illustrated in FIG. 13 is just an example.However, the exemplary embodiments are not limited. The motion sensorpixel M, according to the embodiments, may be applied to any pixel thatsenses the motion of an object.

FIG. 14 is a block diagram of an image sensor 100B according to otherembodiments. The image sensor 100B is another example of the imagesensor 100 illustrated in FIG. 1. Referring to FIGS. 1 and 14, the imagesensor 100B may include a color sensor pixel array 110A including colorsensor pixels C only, and a motion sensor pixel array 110B includingmotion sensor pixel M only. In this case, the row driver 130 may enablethe color sensor pixels C in the color sensor pixel array 110A accordingto the control of the control logic 120. The motion sensor pixel enablecontroller 140 may control the enabling or disabling of the motionsensor pixels M in the motion sensor pixel array 110B according to thecontrol of the control logic 120.

FIG. 15 is a block diagram of an image sensor 100C according to furtherembodiments. FIG. 16 is a block diagram of an image sensor 100Daccording to other embodiments. The image sensors 100C and 100D areother examples of the image sensor 100 illustrated in FIG. 1. Referringto FIGS. 1, 15, and 16, the image sensors 100C and 100D may not includethe motion sensor pixel enable controller 140.

The pixel signal processing circuit 150 may control an output of each ofthe motion sensor pixels M under the control of the control logic 120.In detail, in a state where the motion sensor pixels M are enabled, onlyoutput of each of the color sensor pixels C and the motion sensor pixelsM can be controlled by the pixel signal processing circuit 150.

When the motion sensor pixels M are DVS pixels, the motion sensor pixelsM may not output an event signal according to a signal received from thepixel signal processing circuit 150.

FIG. 17 is a block diagram of an image sensor 100A-2 including anotherexample 150B of the pixel signal processing circuit 150 illustrated inFIG. 2. FIG. 18 is a block diagram of an image sensor 100A-3 includinganother example 150C of the pixel signal processing circuit 150illustrated in FIG. 2. Referring to FIGS. 2, 17, and 18, the motionsensor pixels M are DVS pixels in the image sensors 110A-2 and 110A-3.

Referring to FIG. 17, the column AER 154 and the read-out circuit 156may be implemented in separate circuits, respectively, in the pixelsignal processing circuit 150B. In addition, the row AER 158 in thepixel signal processing circuit 150B may be implemented at the same sideas the row driver 130.

A row AER and row driver block 132 may include the row driver 130 andthe row AER 158. The row AER and row driver block 132 may be dividedinto the row AER 158 and the row driver 130 functionally and logically,but not necessarily physically.

Referring to FIG. 18, the pixel signal processing circuit 150C mayinclude a column AER and read-out circuit block 152 and the row AER 158.The column AER and read-out circuit block 152 may include the column AER154 and the read-out circuit 156. The column AER and read-out circuitblock 152 may be divided into the column AER 154 and the read-outcircuit 156 functionally and logically, but not necessarily physically.

The column AER and read-out circuit block 152 may process an eventsignal output from a motion sensor pixel M, and a pixel signal outputfrom a color sensor pixel C using a single method (or logic). In thiscase, a separate block for performing analog-to-digital conversion ofthe pixel signal output from the color sensor pixel C may be implementedinside or outside the column AER and read-out circuit block 152. Thiswill be described in detail with reference to FIG. 19.

The row AER 158 may be implemented opposite the row driver 130. A rowaddress value of a motion sensor pixel M, that has generated an eventsignal according to the change in the quantity of light, may betransmitted from the row AER 158 to the column AER and read-out circuitblock 152.

FIG. 19 is a block diagram of a modification 150C′ of the pixel signalprocessing circuit 150C illustrated in FIG. 18. Referring to FIGS. 18and 19, the pixel signal processing circuit 150′ illustrated in FIG. 18may include a column AER and analog front end (AFE) circuit block 152′,the row AER 158, an output selection circuit 160′, and ananalog-to-digital converter (ADC) block 172.

The column AER and AFE circuit block 152′ may include the column AER 154and an AFE circuit 170. The AFE circuit 170 may be a circuit includingelements performing operations before analog-to-digital conversion amongelements included in the read-out circuit 156. The column AER and AFEcircuit block 152′ may be divided into the column AER 154 and the AFEcircuit 170 functionally and logically, but not necessarily physically.

The column AER and AFE circuit block 152′ may process an event signaloutput from a motion sensor pixel M and a pixel signal output from acolor sensor pixel C using a single method (or logic).

The column AER and AFE circuit block 152′ may process an event signaloutput from a motion sensor pixel M and a pixel signal output from acolor sensor pixel C. The column AER and AFE circuit block 152′ may senda processing result (e.g., a result of processing the pixel signal fromthe color sensor pixel C), which requires analog-to-digital conversion,to the ADC block 172 and send a processing result (e.g., a result ofprocessing the event signal from the motion sensor pixel M), which doesnot require the analog-to-digital conversion, to the output selectioncircuit 160′.

The ADC block 172 may perform the analog-to-digital conversion on theprocessing result received from the column AER and AFE circuit block152′ and send a digital signal obtained through the conversion to theoutput selection circuit 160′. The ADC block 172 may include a CDScircuit (not shown), a ramp generator (not shown), a comparator (notshown), and a counter (not shown), and may perform the analog-to-digitalconversion according to the control of the control logic 120.

The output selection circuit 160′ may select and process a signaltransmitted from the column AER and AFE circuit block 152′ and a signaltransmitted from the ADC block 172 so as to output the image data IDATA.

FIG. 20 is a block diagram of an image sensor 100A-4 including anotherexample of the pixel signal processing circuit 150 illustrated in FIG.2. The image sensor 100A-4 includes a pixel signal processing circuit150D.

The row AER 158 may be implemented at the same side as the row driver130. The row AER and row driver block 132 may include the row driver 130and the row AER 158. The row AER and row driver block 132 may be dividedinto the row AER 158 and the row driver 130 functionally and logically,but not necessarily physically.

FIG. 21 is a block diagram of an image sensor 100C-1 including anexample of the pixel signal processing circuit 150 illustrated in FIG.15. FIG. 22 is a block diagram of an image sensor 100C-2 includinganother example of the pixel signal processing circuit 150 illustratedin FIG. 15. FIG. 23 is a block diagram of an image sensor 100C-3including another example of the pixel signal processing circuit 150illustrated in FIG. 15. FIG. 24 is a block diagram of an image sensor100C-4 including another example of the pixel signal processing circuit150 illustrated in FIG. 15.

Referring to FIG. 15 and FIGS. 21 through 24, the image sensors 100C-1through 100C-4 include motion sensor pixels M implemented by DVS pixelsand do not include the motion sensor pixel enable controller 140illustrated in FIG. 2. The enabled state of the motion sensor pixels Mincluded in the pixel array 110 in the image sensors 100C-1 through100C-4 are maintained, and the output of the motion sensor pixels M maybe controlled by the column AER 154 and the row AER 158.

Referring to FIG. 13 and FIGS. 21 through 24, the column AER 154 and therow AER 158 may maintain the voltage Vout, which is a reference based onwhich the motion sensor pixels M generate an event signal, at an initialstate (e.g., a reset state) according to the control of the controllogic 120, thereby inhibiting the motion sensor pixels M from generatingan output (i.e., the event signal). For instance, when the color sensorpixels C are enabled according to the mode selection signal MSEL, thecolumn AER 154 and the row AER 158 may inhibit the motion sensor pixelsM from generating an output (e.g., an event signal) according to thecontrol of the control logic 120.

Apart from the above-described feature, the structures and theoperations of the pixel signal processing circuits 150A through 150Drespectively illustrated in FIGS. 21 through 24 are substantially thesame as those of the pixel signal processing circuit 150A through 150D,which are respectively illustrated in FIGS. 3, 17, 18, and 20.

FIG. 25 is a flowchart of a method of operating an image sensor chipaccording to some embodiments. Referring to FIGS. 1 through 3 and FIGS.14 through 25, the control logic 120 may enable a color sensor pixel Cor a motion sensor pixel M based on the mode selection signal MSEL inoperation S10.

The mode selection signal MSEL may be generated by the CPU 210 accordingto a result of analyzing a user's input entered through the peripheralcircuit 220, e.g., an input interface. The control logic 120 may enablethe color sensor pixel C by controlling the row driver 130 and enablethe motion sensor pixel M by controlling the motion sensor pixel enablecontroller 140.

The pixel signal processing circuit 150 may process a pixel signaloutput from the color sensor pixel C or the motion sensor pixel M, whichhas been enabled, in operation S12.

FIG. 26 is a flowchart of a method of operating an image sensor chipaccording to other embodiments. Referring to FIGS. 1 through 3 and FIGS.14 through 26, when the image processing system 10 is powered on, theCPU 210 may output the mode selection signal MSEL at a level set bydefault. The control logic 120 may enable a motion sensor pixel M bydefault, based on the mode selection signal MSEL in operation S20.

A pixel signal output from the motion sensor pixel M that has beenenabled may be processed by the pixel signal processing circuit 150, andprovided as the image data IDATA for the ISP 200. The ISP 200 mayprocess the image data IDATA and transmit the processed image dataIDATA′ to the CPU 210. The CPU 210 may change the level of the modeselection signal MSEL based on the processed image data IDATA′ inoperation S22. In other words, the CPU 210 may change the level of themode selection signal MSEL based on the pixel signal output from themotion sensor pixel M.

Operations S24 and S26 are substantially the same as operations S10 andS12 illustrated in FIG. 25. Thus, detailed descriptions will be omitted.

FIG. 27 is a flowchart of a method of operating an image sensor chipaccording to further embodiments. Referring to FIGS. 2, 3, 14 through24, and 27, the motion sensor pixel enable controller 140 may enable amotion sensor pixel M in operation S30.

The control logic 120 may determine whether to enable a color sensorpixel C based on the mode selection signal MSEL in operation S32. Thepixel signal processing circuit 150 may process a pixel signal outputfrom the motion sensor pixel M or the color sensor pixel C in operationS34. The pixel signal processing circuit 150 may process the pixelsignal output from the color sensor pixel C when the color sensor pixelC is enabled and may process the pixel signal output from the motionsensor pixel M when the color sensor pixel C is not enabled.Alternatively, when the color sensor pixel C is enabled, the outputselection circuit 160 may select and process the pixel signal from themotion sensor pixel M or the pixel signal from the color sensor pixel Cand output the image data IDATA.

FIG. 28 is a block diagram of an electronic system 1000 including animage sensor 100 illustrated in FIG. 1 according to some embodiments.Referring to FIGS. 1 and 28, the electronic system 1000 may beimplemented by a data processing apparatus, such as a mobile phone, apersonal digital assistant (PDA), a portable media player (PMP), an IPTV, or a smart phone that can use or support the mobile industryprocessor interface (MIPI) interface. The electronic system 1000includes the image sensor 100, an application processor 1010, and adisplay 1050.

A camera serial interface (CSI) host 1012 included in the applicationprocessor 1010 performs serial communication with a CSI device 1041included in the image sensor 1040 through CSI. For example, an opticalserializer may be implemented in the CSI host 1012, and an opticalde-serializer may be implemented in the CSI device 1041.

A display serial interface (DSI) host 1011 included in the applicationprocessor 1010 performs serial communication with a DSI device 1051included in the display 1050 through DSI. For example, an opticalserializer may be implemented in the DSI host 1011, and an opticalde-serializer may be implemented in the DSI device 1051.

The electronic system 1000 may also include a radio frequency (RF) chip1060 which communicates with the application processor 1010. A physicalchannel (PHY) 1013 of the electronic system 1000 and a PHY of the RFchip 1060 communicate data with each other according to a MIPI DigRFstandard. The electronic system 1000 may further include at least oneelement among a GPS 1020, a storage device 1070, a microphone 1080, adynamic random access memory (DRAM) 1085, and a speaker 1290. Theelectronic system 1000 may communicate using world interoperability formicrowave access (Wimax) 1030, wireless lan (WLAN) 1100 or ultrawideband (UWB) 1110, etc.

FIG. 29 is a block diagram of an image processing system 1100 includingthe image sensor 100 illustrated in FIG. 1 according to someembodiments. Referring to FIGS. 1 and 29, the image processing system1100 may include the image sensor 100, a processor 1110, a memory 1120,a display unit 1130, and an interface 1140.

The processor 1110 may control the operations of the image sensor 100.The processor 1110 may generate 2D, 3D and/or motion image data based oncolor information, depth information, and motion information receivedfrom the image sensor 100.

The memory 1120 may store a program for controlling the operations ofthe image sensor 100 through a bus 1150 according to the control of theprocessor 1110 and images generated by the processor 1110. The processor1110 may access the information stored in the memory 1120 and executethe program. The memory 1120 may be implemented by a non-volatilememory.

The image sensor 100 may generate 2D, 3D and/or motion image data basedon a digital pixel signal (e.g., color information, depth information,or motion information) under the control of the processor 1110. Thedisplay unit 1130 may display images received from the processor 1110 orthe memory 1120 using a display (e.g., a liquid crystal display (LCD) oran active matrix organic light emitting diode (AMOLED) display). Theinterface 1140 may be provided for the input or output of 2D or 3Dimages. The interface 1140 may be implemented as wireless interface.

Exemplary embodiments can also be embodied as computer-readable codes ona computer-readable medium. The computer-readable recording medium isany data storage device that can store data as a program which can bethereafter read by a computer system. Examples of the computer-readablerecording medium include read-only memory (ROM), random-access memory(RAM), CD-ROMs, magnetic tapes, floppy disks, and optical data storagedevices.

The computer-readable recording medium can also be distributed overnetwork coupled computer systems so that the computer-readable code isstored and executed in a distributed fashion. Also, functional programs,codes, and code segments to accomplish the exemplary embodiments can beeasily construed by programmers.

As described above, according to some embodiments image data is obtainedbased on pixel signals output from color sensor pixels, so that a 2Dcolor image of an object can be precisely recognized. In addition, inother cases, image data is obtained based on pixel signals output frommotion sensor pixels, so that power consumption can be reduced. In otherwords, according to specific circumstances, a selection can be performedto either precisely recognize the 2D color image of an object or reducepower consumption.

While exemplary embodiments have been particularly shown and describedwith reference to exemplary embodiments it will be understood by thoseof ordinary skill in the art that various changes in forms and detailsmay be made therein without departing from the spirit and scope of theexemplary embodiments as defined by the following claims.

1-8. (canceled)
 9. An image sensor chip comprising: a pixel array comprising a color sensor pixel group, the color sensor pixel group comprises a plurality of color sensor pixels, and a dynamic vision sensor (DVS) pixel group, the DVS pixel group comprises a plurality of DVS pixels sensing a motion of an object; a control circuit which is configured to enable one of the color sensor pixel group and the DVS pixel group according to a mode selection signal; and a pixel signal processing circuit which is configured to process pixel signals, output from the enabled pixel group.
 10. The image sensor chip of claim 9, further comprising a motion sensor pixel enable controller, which is configured to control a power supply to the DVS pixel group according to a control of the control circuit.
 11. The image sensor chip of claim 9, wherein the pixel signal processing circuit comprises: a row address event representation (AER) which is configured to process at least one of a plurality of event signals generated by the respective DVS pixels; and a column AER which is configured to process at least another one of the event signals generated by the respective DVS pixels, and the row AER is disposed opposite a row driver which enables each of the color sensor pixels.
 12. The image sensor chip of claim 9, wherein the pixel signal processing circuit comprises: a row address event representation (AER) which is configured to process at least one of a plurality of event signals generated by the respective DVS pixels; and a column AER which is configured to process at least another one of the event signals generated by the respective DVS pixels, and the row AER is disposed at a same side as a side of a row driver which enables each of the color sensor pixels.
 13. The image sensor chip of claim 9, wherein the DVS pixel group is separately disposed from the color sensor pixel group.
 14. The image sensor chip of claim 9, wherein each of the DVS pixels is disposed among the color sensor pixels.
 15. The image sensor chip of claim 9, wherein the DVS pixels are disposed at an edge of the color sensor pixel group.
 16. The image sensor chip of claim 9, wherein the DVS pixels alternate with the color sensor pixels in a row direction.
 17. The image sensor chip of claim 9, wherein the DVS pixels alternate with the color sensor pixels in a column direction.
 18. The image sensor chip of claim 9, wherein the DVS pixels are a different size than the color sensor pixels.
 19. The image sensor chip of claim 9, wherein among the DVS pixels and the color sensor pixels, a DVS pixel and a color sensor pixel that have a same column address share at least one signal line with each other.
 20. The image sensor chip of claim 9, wherein the pixel signal processing circuit comprises: a motion sensor pixel signal processing circuit which is configured to process the pixel signals output from the DVS pixel group; and a color sensor pixel signal processing circuit which is configured to process the pixel signals output from the color sensor pixel group.
 21. The image sensor chip of claim 20, further comprising an output selection circuit which is configured to select one of an output of the motion sensor pixel signal processing circuit and an output of the color sensor pixel signal processing circuit.
 22. A system-on-chip (SoC) comprising: the image sensor chip of claim 9; an image signal processor (ISP) which is configured to process image data output from the image sensor; and a central processing unit (CPU) which is configured to receive processed image data from the ISP and generate the mode selection signal based on the processed image data.
 23. An image sensor chip comprising: a pixel array comprising a color sensor pixel, a depth sensor pixel, and a dynamic vision sensor (DVS) pixel; and an output selection circuit which is configured to select one of a signal received from the color sensor pixel and the depth sensor pixel and a signal received from the DVS pixel according to a mode selection signal, and output the selected signal.
 24. The image sensor chip of claim 23, wherein the color sensor pixel is a pixel selected from a group consisting of a red pixel, a green pixel, and a blue pixel, and wherein the color sensor pixel and the depth sensor pixel are arranged in a Bayer pattern.
 25. The image sensor chip of claim 23, wherein the output selection circuit comprises a multiplexer.
 26. An image processing system comprising: an image sensor which generates digital image data corresponding to either color image data from at least one color sensor pixel or motion image data from at least one motion sensor pixel, and transmits the digital image data; an image signal processor (ISP) which is configured to receive and process the digital image data from the image sensor, and transmit the processed image data; and a display unit which receives the processed image data from the ISP, and displays the processed image data.
 27. The image processing system of claim 26, further comprising: a central processing unit (CPU) which is configured to generate a mode selection signal according to one of the processed image data from the ISP and a signal from a power monitoring module, and transmit the mode selection signal.
 28. The image processing system of claim 27, wherein the power monitoring module determines whether the image processing system has sufficient power, and transmits the signal to the CPU when the image processing system does not have sufficient power.
 29. The image processing system of claim 27, wherein the image sensor generates the digital image data corresponding to either the color image data or the motion image data based on the mode selection signal from the CPU. 